液体静压转台在晶圆减薄中的应用Hydrostatic rotary table in wafer thinning

晶圆背面减薄准备状态,展示真空吸盘与偏置杯形砂轮

应用介绍Overview

超高回转精度与低扰动特性,可满足晶圆减薄、精密研磨及半导体制造过程中的稳定支撑需求。Ultra-high rotation accuracy and low disturbance for wafer thinning, precision grinding and semiconductor manufacturing.

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